Leading edge process engineering
Where am I?
200 mm & 300 mm
State-of-the-art nanopatterning capabilities using electron beam direct write lithography, DUV and iLine stepper for 200 mm and 300 mm.
Deposition via CVD, PVD, ALD and EPI, available for 200 mm & 300 mm.
300 mm ECD process development for galvanic deposition of metal layers through electrolyte screening, bath life time investigation and process characterization.
CMP processes development for new materials to fulfill the demands of the next gen technology nodes for 200 mm and 300 mm.
Screening and optimization of new chemicals and processes from laboratory scale up to 2x nm node test wafer evaluation for 200 mm and 300 mm.
200 mm
200 mm deep reactive ion etching (DRIE), metals, oxides, nitrides, etc.
RXRF, SEM and inline characterization for 200 mm and 300 mm.
Backend Assemnly, waferbonding, dicing, packaging and heterointegration for 200 mm.
in cooperation with:
High Performance Center Mikronano
200 mm & 300 mm Fab Services
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